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Equipped with chamber heating function, specifically designed for coating the inner and outer walls of multi curvature curved workpieces; Multi curvature planar samples are achieved through three-dimensional movement and target scanning, and the sputtering system can independently control the movement to achieve uniform or non-uniform coating on the samples.
1. Can achieve various metal film plating; Example: Aluminum, copper, chromium, titanium, silver, nickel, etc
2. It can achieve the deposition of various compound thin films, such as transparent conductive films of titanium oxide, silicon oxide, ITO, ZAO, etc
3. It can achieve multi-layer film and multi-element compound film deposition and plating
4. It can achieve ion source assisted deposition and surface activation treatment of workpieces, improving the adhesion of the film layer
Equipment model | JCPF2600 |
Coating method | magnetron sputtering |
Vacuum chamber structure | SUS304 square box type |
Vacuum chamber size | L2600mmxH700mmxW260mm |
Ultimate vacuum | better than 5.0x10-5Pa |
Substrate table size | 300mmx400mm, backward compatible with 300mmx300mm |
Substrate temperature | room temperature |
Sputtering target | 1 set of rectangular plane targets, 2 sets of rotating cylindrical targets |
Control method | PLC/PC control (optional) |
Occupancy area | 15000mmx5000mm |
Total power supply | ≥ 20kW three-phase five-wire system |
