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Vacuum evaporation is a technology that heats and evaporates a target material under vacuum conditions, causing a large number of atoms and molecules to vaporize and leave the liquid plating material or the solid plating material surface (or sublimate), and ultimately deposit on the substrate surface. During the entire process, gaseous atoms and molecules will migrate directly to the substrate through minimal collisions in vacuum, and deposit on the surface of the substrate to form a thin film. The methods of evaporation include resistance heating, high-frequency induction heating, high-energy bombardment of plating materials by electron beams, laser beams, ion beams, etc.
Sputtering coating refers to the process of using functional particles (such as argon ions) to bombard the surface of a target material under vacuum conditions, allowing the atoms on the surface of the target material to gain sufficient energy and escape, which is called sputtering. Filling argon gas (Ar) under vacuum conditions and subjecting it to glow discharge at high voltage can ionize argon (Ar) atoms into argon ions (Ar+). Under the action of electric field force, argon ions accelerate and bombard the cathode target material made of plating material, and the target material will be sputtered out and deposited on the surface of the workpiece.
3、Plasma coating
In physical vapor deposition, cold cathode arc evaporation is commonly used, with solid plating material as the cathode, and water cooling is used to form many bright spots on the surface of the cold cathode, namely cathode arc spots. The arc spot is the root of the arc near the cathode. Under vacuum conditions, arc discharge is carried out between the vacuum gold wall (anode) and the plating material (cathode) using an arc ignition needle. Multiple cathode arc spots quickly move on the surface of the cathode, continuously evaporating and even "heterochromatic" the plating material, ionizing it into an arc plasma mainly composed of the plating material, and quickly depositing the plating material on the substrate.
4、Ion Plating
The basic principle of ion plating is to use a certain plasma ionization technology under vacuum conditions to partially ionize the atoms of the plating material into ions, while generating many high-energy neutral atoms and applying a negative bias voltage to the substrate being plated. Under the action of deep negative bias, ions deposit on the surface of the substrate to form a thin film.
5、molecular beam epitaxy
It is a new technology for preparing single crystal thin films, which is a method of growing thin films layer by layer along the crystal axis direction of the substrate material under appropriate substrate and conditions. The advantages of this technology are: low substrate temperature, slow film growth rate, easy precise control of beam intensity, and rapid adjustment of film composition and doping concentration with changes in the source. This technology has been used to prepare single crystal thin films as thin as dozens of atomic layers, as well as ultra-thin quantum microstructure materials formed by alternately growing thin films of different compositions and doping.
