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It has the characteristics of high vacuum degree, fast pumping speed, and convenient substrate loading and unloading. Equipped with E-type electron beam evaporation source and metal evaporation source, optional online film thickness detection system, as well as optional ion source cleaning and auxiliary deposition device.
In addition to the conventional evaporation of low melting point metals, materials such as refractory metals, oxides, fluorides, and organic compounds can also be evaporated for the preparation of optical thin films, conductive thin films, semiconductor thin films, ferroelectric thin films, etc., which can be used in combination with glove boxes.
Equipment model | TEMD600 |
Coating method | E-type electron gun |
Vacuum chamber structure | vertical cylindrical side-opening structure, rear exhaust system |
Vacuum chamber size | Φ600mm×H750mm |
Heating temperature | room temperature ~ 300℃ |
Substrate stage size | flat type Φ350mm, or ball cover type substrate stage (optional) |
Film thickness unevenness | ≤ ±5.0% |
Kaufman ion source | optional |
Evaporation source | electron gun 10KW, 6-hole crucible, domestic/imported (optional), equipped with 2 sets of resistance evaporation |
Control method | PLC/PC (optional) |
Footprint | L2500mm×W1600mm |
Total power | ≥ 17kW |
