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Used for scientific research and small-scale preparation of thin film new materials, it consists of magnetron sputtering chamber, wafer storage chamber, transfer manipulator, vacuum system, sputtering target, sputtering power supply, intake system, fully automatic control system, etc.
1. Suitable for developing nanoscale single-layer, multi-layer, and composite film layers, etc;
2. Suitable for preparing metal films, alloy films, semiconductor films, ceramic films, and dielectric films; Example: Silver, aluminum, copper, nickel, chromium, nickel chromium alloy, titanium oxide, titanium nitride, chromium nitride, ITO, silicon dioxide, etc;
3. Suitable for multi-target individual sputtering, sequential sputtering, and co sputtering
Equipment model | JCPY500 |
Vacuum chamber structure | rear exhaust system |
Vacuum chamber size | Φ500mm×H450mm with Load-Lock function, supports single or multiple slices in and out sampling |
Heating temperature | room temperature ~ 500℃ |
Substrate table size | Φ150mm |
Film thickness non-uniformity | ≤ ±5.0% within Φ100mm |
Sputtering target | Φ3、Φ4 inch magnetron target 2-4 (optional) |
Process gas | 3-way gas flow control |
Control mode | PLC/PC (optional) |
Footprint (main unit) | L1800mm×W800mm×H1845mm |
Total power | ≥ 15kW |
