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It has the characteristics of high vacuum degree, fast pumping speed, and convenient substrate loading and unloading. Equipped with E-type electron beam evaporation source and metal evaporation source, optional online film thickness detection system, as well as optional ion source cleaning and auxiliary deposition device.
In addition to the conventional evaporation of low melting point metals, materials such as refractory metals, non-metallic oxides, and alloys can be evaporated, which can be used to prepare optoelectronic thin films, semiconductor device thin films, ferroelectric thin films, etc., and can be used in combination with glove boxes.
Equipment model | TEMD500 |
Coating method | E-type electron gun |
Vacuum chamber structure | vertical cylindrical side-opening structure, rear exhaust system |
Vacuum chamber size | Φ500mm×H600mm |
Heating temperature | room temperature ~ 300℃ |
Substrate table size | flat type Φ200mm |
Film thickness unevenness | ≤ ±5.0% |
Kaufman ion source | optional |
Evaporation source | electron gun 10KW, 6-hole crucible, domestic/imported (optional), equipped with 2 sets of resistance evaporation |
Control method | PLC/PC (optional) |
Floor area | L2500mm×W1600mm |
Total power | ≥ 17kW |
Scope of application | colleges and universities, research institutes and enterprises for scientific research and small-batch preparation of new thin film materials |
